CR-815SH ACF BONDING MACHINE
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General Specifications:
- Frequency: 50 Hz
- Capacity: 0-100 units per day
- Camera: PCB Side
- Packaging Type: Wooden Box Packing
- Machine Dimensions: 1240 × 840 × 1680 mm
- Brand: WeiCAi
- Stroke: 1
Bonding Features:
COF Bonding Mode: Pulse (Rapid Heating/Cooling and Auxiliary Cooling).
PID Temperature Control: Omron PID system for precise temperature rise curve adjustments with high-precision auto-tuning.
Display Screen: Down counterpoint optical system: Lens > Quartz > ITO Electrode > COF.
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Additional Information
Application:
- Used for bonding FPC, COF, TAB, LCD panels, and PCBs.
- Supports various LCD specifications, including vertical, horizontal, and diverse panel designs (e.g., black belt, colored ribbon, multi-line).
- Suitable for panel sizes from 15″ to 65″ (expandable platform).
Device Features:- Single-Head, Pneumatic System: Provides precise pressure and bonding.
- Single Temperature Control: For targeted, consistent results.
- Multi-Speed Pulse Design: Adapts to the power requirements of diversified products.
Additional Information:- Item Code: AN
- Delivery Time: 15-30 days
- Production Capacity: 50-100 units/month
Packaging Details:- Dimensions: 1800 × 1200 × 1520 mm (L × W × H).
- Net Weight: 430 kg.
- Packaging: Wooden boxes (non-logs, glued board, no fumigation required).
Device Uses:This equipment is ideal for repairing and bonding LCD panels, FPCs, and PCBs. It addresses vertical and horizontal alignment, ribbon and multi-line configurations, and various LCD display breakdowns.Invest in the CR-815SH-19M for high-precision, versatile bonding solutions tailored to modern repair and manufacturing needs. -
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